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Typical Electrical Characteristics (continued)
4
20
S(O
LIM
10m
3
V DS =- 5V
T J = -55°C
25°C
10
5
2
RD
N)
IT
1m
s
s
2
1
125°C
1
0.5
0.1
V GS = -2.7V
SINGLE PULSE
100
1s
1 0 s
D C
ms
0.03
R θ JA = See Note 1b
T A = 25°C
0
0
-0.5
-1
-1.5
-2
-2.5
-3
0.01
0.1
0.2
0.5
1
2
5
10
20
50
I D , DRAIN CURRENT (A)
Figure 13. Transconductance Variation with
Drain Current and Temperature .
1
-V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 14. Maximum Safe Operating Area .
1.4
0.8
1.2
0.6
1a
0.4
1b
1
1b
T A = 25 C
0.2
4.5"x5" FR-4 Board
0.8
1a
4.5"x5" FR-4 Board
o
Still Air
T A = 25 o C
Still Air
V GS = -2.7V
2oz COPPER MOUNTING PAD AREA (in )
0
0
0.1 0.2 0.3
2
0.4
0.6
0
0.1 0.2 0.3
2
2oz COPPER MOUNTING PAD AREA (in )
0.4
Figue 15. SuperSOT TM _ 3 Maximum
Steady-State Power Dissipation versus
Copper Mounting Pad Area.
1
Figure 16. Maximum Steady-State Drain
Current versus Copper Mounting Pad Area .
0.5
D = 0.5
0.2
0.1
0.05
0.2
0.1
0.05
R θ JA (t) = r(t) * R θ JA
R θ JA = See Note 1b
P(pk)
0.02
0.01
0.02
0.01
t 1
t 2
0.005
Single Pulse
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 /t 2
0.002
0.001
0.0001
0.001
0.01
0.1
1
10
100
300
t 1 , TIME (sec)
Figure 17. Transient Thermal Response Curve.
Note : Characterization performed using the conditions described in note 1b. Transient thermal response will
change depending on the circuit board design.
NDS332PRev. E
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